Product Details

The AMAT ABX-X284 is a precision cathode assembly and chamber component, also known as a plasma part, cross-referenced with AMAT part numbers 0200-36034 and 0051-02153, designed for Applied Materials semiconductor deposition process platforms. It is installed inside the vacuum process chamber, serving as the core plasma generation component for thin film deposition processes. This plasma part forms stable plasma under controlled gas and power conditions, which directly defines thin film deposition uniformity, film quality and process repeatability on silicon wafers. It maintains consistent plasma state during continuous wafer deposition cycles. If plasma instability or abnormal erosion occurs, the component will affect the process result and trigger equipment alarms to protect wafers and chamber hardware. Optimized for semiconductor cleanroom environments, this cathode assembly uses high-purity sputtering material with low outgassing property, minimizing particle contamination and impurity release inside the vacuum chamber. It can withstand plasma bombardment, thermal cycling and reactive process gas corrosion for long-duration fab operation.

This chamber component adopts precision machining and strict surface treatment, with controlled surface finish to guarantee uniform target erosion. The assembly is pre-tested for vacuum sealing and plasma performance before delivery. It features standardized mounting interface for fast installation and replacement during chamber maintenance. The working temperature range is -10℃ to +60℃, suitable for the internal vacuum operating environment of AMAT wafer processing tools. This plasma part is widely used for chamber overhaul, worn cathode replacement and process system maintenance. Installing AMAT ABX-X284 can recover stable plasma generation and thin film deposition capability and reduce production downtime.

Specifications

Brand: AMAT (Applied Materials)

Model: ABX-X284

Cross PN:0200-36034,0051-02153

Product Type: Simple Cathode Assembly

Alias: Plasma Cathode, Chamber Sputter Component

Feature: High purity material, low outgassing, plasma resistant

Function: Plasma generation, thin film sputter deposition

Operating Temperature:-10℃~+60℃

Application:Semiconductor manufacturing vacuum deposition chamber