Product Details
The ABX-X272 is a precision wafer part and handling assembly, also known as a transfer component, designed for semiconductor wafer processing manufacturing tools. It is installed on the wafer handling robot end effector, responsible for picking, supporting and transferring silicon wafers between wafer cassettes, load locks and process chambers. This transfer component maintains stable wafer holding during wafer loading, unloading and transmission processes of etching, deposition and cleaning. It adopts low particle and low outgassing material to avoid wafer surface contamination and scratches, which is critical for improving production yield in semiconductor manufacturing. Optimized for cleanroom fab environments, this wafer part has excellent static dissipation performance, effectively preventing electrostatic discharge damage to sensitive wafers and thin film layers. It can withstand long-term repeated cyclic movement and temperature fluctuations inside the equipment, maintaining stable mechanical performance during continuous fab operation.
This handling assembly has a compact structural design, precisely matched with robot end effector interface for fast installation and replacement during equipment maintenance. The contact surface is specially treated to reduce friction and particle generation. Strict dimensional tolerance control ensures accurate wafer positioning during transfer. The working temperature range is -10℃ to +60℃, suitable for the internal operating environment of semiconductor wafer processing tools. This transfer component is widely used for equipment maintenance, worn wafer end effector replacement and robot system overhaul. Installing ABX-X272 can restore stable wafer transfer function and minimize production downtime.
Specifications
Brand: Semiconductor OEM
Model: ABX-X272
Product Type: Wafer Handling Assembly
Alias: Wafer Transfer Component, End Effector Part
Material: Low outgassing, anti-static, low particle material
Feature: Anti-static, scratch resistant, cleanroom grade
Function: Wafer support, wafer pick & transfer
Operating Temperature:-10℃~+60℃
Application:Semiconductor manufacturing equipment